JAKARTA - Samsung is reportedly developing a new cooling solution for the Exynos smartphone processor in the future. This packaging technology is reportedly from PCs and servers, and involves the type of heatsink installed above the processor.
The development of this technology is expected to be completed in Q4 2024, thus allowing the Exynos 2500 to use it. The Exynos 2400 processor is a fairly good flagship processor, although it is known to have a slightly hotter temperature than the Snapdragon 8 Gen 3. Now, it appears that Samsung has a new cooling solution for the future Exynos chip.
According to a report from The Elec, Samsung is developing a new chip packaging technology called the fan-out wafer-level package-HPB (FOWSP-HPB). This technology involves installing heatsink types, called heat path blocks (HPB), on top of the chipset.
The report mentions that this heatsink technology comes from PCs and servers, and is expected to be used on Exynos processors in the future. The site also adds that this technology has just arrived on smartphones now because of its smaller form factors, suggesting that miniaturization of this technology is a challenge.
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It is estimated that the development of this technology will be completed in Q4 2024, paving the way for mass production afterward. This time shows that the Exynos 2500, which is expected to be used in several Galaxy S25 models, could be equipped with this cooling technology as long as its development is completed in early Q4.
The Exynos 2400 processor has a slightly hotter temperature than the Snapdragon 8 Gen 3 in various tests. Meanwhile, the Exynos 2200, which was released in 2022, is even worse, with significant thrusting problems.
Therefore, this packaging technology will be a huge addition to the future Exynos chip if it works as expected, paving the way for more consistent performance, better battery life, and cooler phones.
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