JAKARTA TSMC, Apple's largest chipmaker and major partner in Apple's Silicon production, has announced the existence of their latest fabrication process technology: 1.4 nanometers (A14) process. This advanced technology is scheduled to enter the mass production phase by 2028 and is expected to be used in iPhone 19 generation chips.
This announcement was made by TSMC at the North America Technology Symposium on Wednesday, April 23. The A14 process is an increase from the N2 (2 nanometer) process, which is planned to start mass production by the end of 2025 and be used in the iPhone 17 Pro.
A14 Process Advantages:
- 15% increase in speed with the same power consumption compared to the 2nm process.
- Up to 30% better power efficiency for equal performance.
- 20% increase in logic density, meaning the number of transistors that can be grown in narrow areas is increasing.
TSMC did not directly mention who the clients would use the A14 technology, but Apple certainly became one of them. So far, Apple has always been a user of TSMC's latest fabrication process for series-A chips on iPhone and Apple Silicon on Mac.
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If all goes according to schedule, the iPhone 19 which was likely released in 2028 could be Apple's first device to use an A21 Pro chip based on the A14 TSMC process. The name A14 is somewhat confusing because previously Apple had used the name A14 Bionic chip, but A14 in this context refers to TSMC manufacturing technology instead of Apple's chip name.
TSMC reports that the A14 process shows progress ahead of schedule, especially in terms of yield (chip production success rate), which adds to the belief that this technology will be ready for use as the iPhone 19 launches in the coming years.
With the smaller transistor size and increased power efficiency, Apple is expected to bring significant performance jumps, especially to support artificial intelligence (AI) processing and advanced multitasking features in future devices.
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