Samsung Invests IDR 4.3 Trillion To Build Chip Packaging Research Facility In Japan

Samsung wants to invest in chip research facilities (photo: dock. unsplash)

JAKARTA Samsung will invest in the construction of Japanese chip packaging research facilities. From the Reuters report, this investment will be worth around US$280 million (Rp4.3 trillion).

Since March, Samsung has been considering building a coaching facility in Kanagawa prefecture using research and development centers already there.

By investing in the research center, Samsung was able to deepen the relationship between the company and the Japanese manufacturer of equipment and chipmakers. However, Samsung has not shown any signs of investing at the time.

Samsung's consideration at that time was welcomed by the Japanese Ministry of Industry. Seeing the huge potential for development in Kanagawa, the government plans to provide subsidies worth 20 billion yen or around Rp. 2.1 trillion.

Not only to help Samsung, this subsidy is provided to support revitalization or revive the domestically made manufacturing industry. Thus, this plan will be a profitable solution for both parties.

Last year, the chipmaker who will get investment from Samsung began strengthening their development department. Some of the developments carried out by the development facility involve combining components in one package.

With this advanced packaging technique being upgraded, thechip performance will also increase overall. Therefore, Samsung's investment in this facility can strengthen the company's position in the chip field.