Intel and Siemens Announce Three-Year Collaboration to Improve Factory Efficiency

Intel's Chief Global Operations, Keyvan Esfarjani (center) (photo: x @KeyvanEsfarjani)

JAKARTA - Intel and Siemens on Monday 4 December announced a three-year agreement to collaborate on improving factory efficiency and automation with a special focus on improving sustainable energy efficiency.

"Intel has big plans with our expansion, but we want to ensure that we do it with a full focus on natural resource efficiency and our commitment to net zero," said Intel's Chief Global Operations, Keyvan Esfarjani, as quoted by VOI from Reuters.

In its efforts to better compete with industry leader Taiwan Semiconductor Manufacturing (TSMC), Intel is undergoing a multibillion-dollar shift in its operations that includes a transition to cutting-edge chip technology known as extreme ultraviolet (EUV) lithography.

"The collaboration with Siemens will help Intel operate factories more efficiently," said Esfarjani.

EUV, a highly energy-intensive technology, is so central to advanced chip manufacturing that most manufacturing processes revolve around this technology. The collaboration with Intel will help Siemens deepen its understanding of this type of manufacturing where a single technology is core to the process and help transfer that knowledge to other industries.

"Other industries are heading in this direction," said Siemens Digital Industries Chief Cedrik Neike. "Semiconductor was the first to really look at it."

Siemens has formed similar partnerships with other major manufacturers such as Mercedes-Benz. In that case, Siemens helped in their transition from producing cars with combustion engines to electric cars.