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JAKARTA - PT Danareksa is again seeking new funding by issuing bonds or debentures with the instrument name Danareksa VII Bonds Year 2023 worth IDR 1 trillion.

The bonds offered consist of 2 series, Series A with a period of 3 years and an indication of a coupon of 7.0% to 7.9% per year and Series B with a term of 5 years and an indication of a coupon of 7.6% to 8.4% per year. year.

Plt. President Director of PT Danareksa (Persero), R. Muhammad Irwan said, the proceeds from this offer after deducting the issuance costs would be used entirely by Danareksa for repayment of the principal banking debt as well as used for the company's working capital.

"We will use this momentum to increase Danareksa's capability in producing new strategic initiatives. In addition, we hope to improve the internal support function in the Holding ecosystem to accelerate the transformation and restructuring process", he said in a statement to the media, Saturday, January 14.

The bond offering is fully supported by the appointed joint lead underwriters, namely PT Mandiri Sekuritas, PT BRI Danareksa Sekuritas, PT BNI Sekuritas, and PT Indo Premier Sekuritas.

Danareksa will carry out the initial bond offering (book building) from January 13 2023 to January 20, 2023. The estimated acquisition of an effective letter from OJK is on January 31 and the bonds are expected to be listed on the Indonesia Stock Exchange on February 9, 2023.


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