Honor Prepares Phone With Dimensity 8500 Chipset And 10,000mAh Battery

JAKARTA - A recent leak from Chinese informant Digital Chat Station (DCS), revealed that Redmi, Honor, and iQOO are developing phones with the latest generation chipset, Dimensity 8500. Now, DCS is posting again on Weibo to confirm the battery capacity of Honor phones using the chipset.

According to DCS, the upcoming Honor phone with the Dimensity 8500 chipset is being tested with a 10,000mAh battery. He also mentioned that this phone has entered the NPI verification stage (New Product Introduction). Currently, there is no information regarding the official name of the device.

Previously, this phone was known to have entered the NPI stage at the end of last July and continues to develop. As mentioned earlier, several brands are developing phones with Dimensity 8500 chipsets. However, it is reported that Redmi Turbo 5 will be the first mobile phone to be launched with SoC D8500.

This indicates that Honor phones with Dimensity 8500 are likely to be released in China shortly after Redmi Turbo 5 in December, or maybe it will only be launched in January 2026. For now, only this chipset and battery capacity of Honor phones has been revealed. It is hoped that the next report will reveal other specifications.

Dimensity 8500 is reportedly the 4nm chipset made by TSMC. Although its CPU architecture has not changed compared to the Dimensity 8400 released last year, its Mali-G720 GPU is said to be able to provide a better gaming experience. This chipset is projected to score more than 2 million points in the AnTuTu benchmark.

Several other phones that are likely to use Dimensity 8,500 include Realme Neo 8 SE and iQOO Z11 Turbo.