Apple A20 Ready To Present A Faster Performance With New Technology On The IPhone 18
JAKARTA Apple is rumored to be carrying the latest A20 chip for the iPhone 18 with a new packaging technology that will provide more flexible configuration options, improve performance, and keep the temperature cool. According to a leak from the "Mobile Phone Chip Expert" on Weibo, the A20 chip will use 2 nanometer technology and WMCM (Wafer-level Multi-Chip Module) packaging.
Apple's chips are currently manufactured by TSMC using InFo (Integrated Fan-Out) technology that allows the chip size to be very compact. However, with the use of WMCM technology, Apple is expected to be able to pack components such as CPUs and GPUs in one smaller chip package without compromising performance.
In addition to using 2nm technology, the A20 chip will also bring an increase in RAM to 12GB for all iPhone 18 models, up from 8GB which is currently in the iPhone 16 series. This increase will support better multitasking capabilities and reduce power consumption and heat, making the iPhone 18 more efficient.
WMCM Chip Packaging Profits
WMCM packaging allows the use of multiple dies in a single chip package, providing Apple with the flexibility to create various CPU and GPU configurations without having to create different dies for each variant.
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This could potentially allow Apple to add additional components to the Pro chip, while the non-Pro version remains using similar technologies, but with a slight feature reduction.
The technology also opens up the possibility for Apple to vertically compile multiple components and distribute others horizontally in the same package, which keeps the chip size small.
With this leak, the iPhone 18 looks set to be a device that brings new innovations in terms of performance and power efficiency, adding user expectations to the future iPhone line.