Apple Introduces M3 Ultra, Chipset With 'Extrem' Workload

The latest M3 Ultra chipset (photo: dock. Apple)

JAKARTA After being developed for more than a year, the M3 Ultra chipset was finally introduced by Apple. This chipset was launched alongside Mac Studio on Wednesday, March 5.

The M3 Ultra is the highest-performance chip Apple has ever developed. Thanks to its large double-binding of Neural Engine, CPU and GPU cores, as well as supporting memory, this chip is claimed to be the industry's leading integrated circuit.

When compared to previous generation chipsets, the M3 Ultra is twice as fast as the M2 Ultra and 2.6 faster than the M1 Ultra. This capability was achieved thanks to a CPU consisting of 24 performance cores and 8 efficiency cores and GPUs with 80 graphic cores.

This chip was created using Apple's UltraFusion packaging architecture that connects two M3 Max die with high-speed connections, as well as offers low latency with high bandwidth. That way, this chip supports massive performance.

The M3 Ultra architecture also features accelerated dynamical charging, sheding mesh, and ray tracing. That way, this chipset can handle heavy workloads, such as games with large capacities and display high graphics.

"Faktanya, M3 Ultra dibuat untuk AI, termasuk aktor ML di CPU, GPU Apple yang paling kuat, Neural Engine, dan bandwidth memori lebih dari 800GB/s," kata Google dalam sebuah keterangan.

The higher the performance needed, the greater the memory needs. Therefore, Apple integrates memory with high bandwidth and low latency in its integrated memory architecture.

This chipset starts with 96GB capacity and can be configured up to 512GB or more than half TB. This memory has surpassed the memory available on workstation graphics cards according to Apple. That way, Ultra M3 is suitable for heavy professional workloads such as 3D rendering, creating visual effects, or running Artificial Intelligence (AI).