JAKARTA - One of the smartphone manufacturers from China, Oppo is allegedly developing its own high-end mobile chipset (flagship). The company aims not to rely on chipmakers like Qualcomm and MediaTek.

The plan is that this new SoC will be embedded in the company's flagship series phones in 2023 or 2024. According to reports, Oppo is interested in utilizing TSMC's 3nm fabrication process to make its own high-end chips used in their flagship devices.

In other words, TSMC will also accept other major mobile brands as their new clients with Apple, Intel, AMD, and Nvidia being some of the other major customers.

The chip development process itself will allow Oppo to have better control over its own supply chain and may also help with the impact of the ongoing global semiconductor shortage. It is known, Oppo is the fourth largest mobile phone brand in the world.

Quoted from Gizchina, Thursday, October 21, several reports also emerged that Oppo has been working on its chips for 3 years and has invested around 7 billion US dollars in this business. Not only Oppo engineers are working on the project, but also Realme, as well as OnePlus.

Until now, Oppo still relied on Qualcomm and MediaTek for its chipset supply, it seems that now the company is aiming to bypass the two chipmakers and enter the OEM group that designs their own chips like Samsung, Apple and now Google. Where Google has also recently launched Pixel 6 and Pixel 6 Pro phones with its own Tensor processor.

For information, Oppo is part of the BBK Electronics company that shares the supply chain with Vivo, OnePlus and Realme. Most likely, we will not only see Oppo's chips in its own devices, but also some of those sub-brands.


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