JAKARTA - Huawei is reportedly developing the latest flagship chipset with a smaller size. The chipset, which is named Kirin 9010, is planned to be used in Huawei's latest flagship smartphone.
The rumors came from gadget leak @ RODENT950. Through his Twitter account, he shared information about the Kirin 9010 chipset which is built in a 3nm fabrication.
Next Gen Kirin (9010) is 3nm. pic.twitter.com/b6WtwdKt7r
- Teme (特米) 😷 (@ RODENT950) January 1, 2021
This is quite surprising, because the chipset with 5nm fabrication is still relatively new for at least the next two years. But Huawei has taken its own path to refine 3nm chipsets, as summarized from Gizmochina, Monday, January 4.
Of course, Huawei's extreme steps will also be followed by other chipset manufacturers. Because, after Huawei announced the Kirin 9000, Samsung immediately followed suit with the Exynos 1080, which was then followed by the Qualcomm Snapdragon 888.
The next leak from @ RODENT950, says that it is likely that the Kirin 9010 chipset will be introduced in the second quarter of 2021. This means that the chipset will be embedded in the Huawei Mate 50 which is also predicted in the fourth quarter.
On the other hand, it is not yet known which company will manufacture the chipset. Considering that Huawei cannot order chip production from TSMC, because it is still on the trade blacklist in several countries.
Meanwhile, Huawei's chip factory is still not that sophisticated for producing 3nm chips. It is also reported that TSMC will only be able to produce chips with a 3nm process in 2022, and Apple has already ordered large quantities of 3nm chips from the Taiwanese company beforehand.
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