JAKARTA - Lightmatter, a startup worth US$4.4 billion (Rp72.8 trillion), on Monday April 1 released two technologies aimed at accelerating connections between artificial intelligence chips (AI).
Instead of moving information between computer chips using electric signals, Lightmatter technology uses optical connections and known as silicon photonics to move information using light.
Headquartered in Mountain View, California, Lightmatter has raised venture funding of US$850 million (Rp14 trillion) to date, as optical technology has triggered a wave of investment in Silicon Valley in a better way to connect chips to support chatbots, image generators, and other AI applications.
AI chipmakers such as Advanced Micro Devices (AMD) have demonstrated the use of optical technology that is packaged with their chips.
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Nvidia also introduced optical technology in some of their network chips earlier this month, although its CEO said the technology was not yet mature enough to be used on all of their chips.
On Monday, Lightmatter introduced two new products designed to be packaged with AI chips. One of them is called an interposer, which is the material layer where AI chips sit to connect with neighboring chips that are also above the interposer. Another product is a chipset, which is a small tile that can be placed on top of an AI chip.
Lightmatter says that the interposer will be released in 2025, and chipsets in 2026. This interposer is produced by GlobalFoundries.
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